Laser Technology
Laser Drilling
Specialized on HDI boards, FIMA uses a laser drilling
machine to drill blind microvias.This equipment allows to
overcome the limitations oft he mechanical Z-controlled
drilling: laser drilling machine drills holes down to 50 μm
hole size with an unbeatable accuracy of the hole position
and depth. Furthermore, this equipment has initiated a huge
impulse to the production of flex and rigid-flex PCBs,
thanks to its extreme ease to run some of the typical
processes involved with this type of products.
LDI (Laser Direct Imaging)
Thanks
to two LDI machines, FIMA has abandoned the traditional film
technology for imaging and is now producing its printed
circuits almost exclusively with Laser Direct Imaging
technology. Using this process, FIMA can achieve an
unbeatable definition for tracks, down to 25 μm of track
width.
LDI technology is applied to image inner layers, outer layers and recently also solder mask. This technology enables FIMA to be much more flexible and to handle priorities efficiently. It is also a perfect to all production requirements of a factory specialized in quick turnaround services like FIMA.
LDI technology is applied to image inner layers, outer layers and recently also solder mask. This technology enables FIMA to be much more flexible and to handle priorities efficiently. It is also a perfect to all production requirements of a factory specialized in quick turnaround services like FIMA.