Technological Profile

Thanks to our CAD/CAM system, which are managed by specialized technicians, we are able to inspect the order for pre-production analysis. The files that are received are reviewed and edited for maximum manufacturability. In our production departments, we utilize every possible method for automation and integration of the operations. Our aim is to avoid deterioration of the material during the job phases. The press operation of the inner layers is done by using a vacuum press with automatic feeding, movement and unloading of the packages. Reference holes for the next drilling phases are done by using an automatic X-Ray system.

 

 

Drilling is done with automated machines that control the diameter of the job tools.
The cleaning and electroplating of the holes is done with a direct deposition system on an automatic horizontal line.
The lamination process, exposure and development of the dry film is done in a dust-free
environment, using an integrated line that makes two head exposures with optical centering
and collimated light.
The concept of automation and integration reaches the maximum expression in the galvanic
process where a high-tech facility system follow the flow of the job while at the same time, managing more cycles of work.
The process of applying, exposing and developing of the solder mask is done by using an automatic exposure with optical centering.
The mechanical finishes are done by using numerical controlled machines linked through the
internal information net to the CAD-CAM system.
The final electric test is done by using test machines that are able to verify the two sides of the printed circuit board at the same time, using a special adaptor or a movable probe system for circuit prototypes.
Both systems use a test program generated by Gerber files.